Latest Generation of Metafoam's Boiling Surfaces Can Manage
Heat Loads Close to 500 Watts

Montreal, January 31^st, 2008

Metafoam Technologies Inc. is proud to announce that its latest generation of boiling surfaces, Vapore^TM, is reaching new heights.

Latest results reveal that Metafoam's boiling surfaces, based on its metal foam technological platform, can handle heat fluxes up to 76 watts per square centimeter, meaning close to 500 watts for a standard processor die.

"This new generation of pool boiling surfaces allows the Company to consolidate its position in the thermal management of high powered electronics", according to Dominic Pilon, Metafoam's Founder and Chief Technology Officer.

Vapore^TM technology can be used in thermosyphons, namely for servers and defense applications but also in HVAC systems.

About Metafoam Technologies

Metafoam Technologies Inc. is specialized in the development and commercialization of innovative open-cell metal foam solutions for thermal management, electrochemistry, and other value-added applications. Thanks to its unique production process, Metafoam is revolutionizing the metal foam industry by offering the highest specific surface area.

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Source:

Karine Vézina
Marketing Director
karine.vezina@metafoam.com

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