Metafoam Will Attend ITherm

 

The Company Calls for Electronics Cooling Suppliers Interested in Innovative Solutions

 

 

Montreal, May 1^st, 2008

 

Metafoam^® Technologies Inc. announces that it will attend ITherm international conference dedicated to electronics cooling from May 28^th to 31^st in Orlando, Florida.

 

Metafoam wishes to take advantage of this forum to meet potential partners interested in the co-development and commercialization of innovative vapor chambers, thermosyphons, and large heat pipes using metal foams wicks and pool boiling surfaces.

 

Dominic Pilon, Founder and CTO, and Karine Vézina, Marketing Director, invite companies involved in products dedicated to electronics cooling to contact them.

 

 

About Metafoam^® Technologies

 

Metafoam^® Technologies Inc. is specialized in the development and commercialization of innovative open-cell metal foam solutions for thermal management, electrochemistry, and other value-added applications. Thanks to its unique production process, Metafoam is revolutionizing the metal foam industry by offering the highest specific surface area.

 

 

About ITherm 2008

 

ITherm 2008 is an international conference and exhibit for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

 

 

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Source:

Karine Vézina

Marketing Director

Phone: +1(450) 444-5678 ext. 226

Mobile: +1(514) 730-8194

E-mail: karine.vezina@metafoam.com

 

 

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