Metafoam is Invited at the Emerging Technology Venture Conference

Posted on Thursday September 02, 2004
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Montreal, Canada, September 2, 2004 – Metafoam Technologies Inc. was selected as one of Canada’s twelve Best Emerging Technology Companies as it was invited to the Emerging Technology Venture Conference (ETVC) 2004 that will be held in Montreal, Quebec on September 14th and 15th, 2004.

ETVC 2004 is Canada’s first conference to bring together high-tech companies with international investors. The event showcases the best technologies in Information Technology, Nanotechnology and Robotics to angel investors and venture capital firms from Canada, the United States, Europe and Asia. The companies were selected from over 40 applications by the ETVC selection committee. The 250 participants expected to attend this event will include some of the most prominent venture capital firms and financial institutions, academics, corporate labs and institutional investors.

About Metafoam Technologies
Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.

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Phone: +1 (450) 444-5678
info@metafoam.com
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