Montreal, Canada, October 22, 2008 – Metafoam’s Founder, Vice President R&D and CTO, Dominic Pilon, has presented the paper “Open-Cell Metal Foams for Electronics Cooling” at the AMD Technical Forum & Exposition 2008 in Taipei, Taiwan. During his presentation Mr. Pilon presented initial test results of 57% increase in performance of Metafoam's metal foams used as wick structures for heat pipes compared to the current industry-wide practice using sintered copper powder.

The AMD Technical Forum & Exposition 2008 has focused on advanced technology for multimedia and graphics platforms and hardware applications. Topics addressed during this forum were numerous and included amongst others:

• Power Technology and Thermal Modeling for Desktop and Notebooks
• EMI Testing
• PCB Manufacturing
• Memory Technologies

For more information on the AMD Technical Forum and Exposition 2008, please visit:
http://www.amd.com/us-en/0%2c%2c3715_15467_15469%2c00.html

About Metafoam
Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.

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Source: Frederic Le Bouar, Marketing Director
Phone: +1 (450) 444 5678 ext. 226
info@metafoam.com