Montreal, Canada, October 23, 2009 – Metafoam Technologies announces the completion of a multi-million dollar investment led by ID Capital and MSBi Capital, two venture capital institutions that have supported Metafoam in previous rounds. This successful funding follows extremely positive tests results from leading Asian manufacturers who will incorporate Metafoam’s copper foam wick structures in their heat pipes to reduce the heat in portable computer. The investment will be used for the set up and installation of Metafoam’s manufacturing facilities in Asia.

“We are pleased with the finalization of this financing round, especially with current economic conditions,” said Vincent Guyaux, President and CEO of Metafoam. “This capital enables us to move forward with our strategy, by establishing manufacturing and operation capabilities in Asia to supply the electronic thermal industry with our products,” Mr. Guyaux added.

About FIER ID and ID Capital
FIER ID, s.e.c. is a fund managed by ID Capital, a venture capital firm which invests in innovative start-up businesses located mainly in the greater Montreal area. The businesses targeted by ID Capital must have developed innovative technologies or products that can be protected through patents and must show vast market potential. Additional information about ID Capital is available at www.idcapital.ca.

About MSBi Capital
MSBi Capital is a seed and early stage venture capital fund dedicated to commercializing innovations in information technology, life sciences, and the physical sciences. MSBi Capital has a particular focus on establishing and building companies based on technology advancements and inventions originating from the universities of McGill, Sherbrooke and Bishop's, as well as their affiliated hospitals and research institutes. More information about MSBi is available at www.msbi.ca.

About Metafoam
Metafoam Technologies is specialized in the development, production and commercialization of open-cell metal foams. Through its patented technologies, Metafoam redefines the open-cell metal foams industry by offering the highest specific surface area. Metafoam focuses on open-cell copper foam wick structures for the electronic thermal management market, in particular for applications such as heat pipes and vapor chambers.

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Source: Frederic Le Bouar, Marketing Director
Phone: +1 (450) 444 5678 ext. 226
info@metafoam.com