<?xml version="1.0" encoding="UTF-8"?>
<!-- generator="snappages.com/1.0" -->
<rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	>
	<channel>
		<title>Metafoam</title>
		<link>http://metafoam.com</link>
		<atom:link href="http://metafoam.com/blog/rss" rel="self" type="application/rss+xml" />
		<description></description>
		<pubDate>Wed, 12 Jan 2011 15:00:00 +0000</pubDate>
		<generator>http://snappages.com</generator>
		<language>en</language>
		<item>
			<title>Metafoam Closes Financing Round</title>
			<link>http://metafoam.com/blog/2011/01/12/metafoam-closes-financing-round</link>
			<comments>http://metafoam.com/blog/2011/01/12/metafoam-closes-financing-round</comments>
			<pubDate>Wed, 12 Jan 2011 15:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2011/01/12/metafoam-closes-financing-round</guid>
			<description><![CDATA[Montreal, Canada, January 12, 2011 – Metafoam Technologies announces the completion of a multi-million dollar investment from its current investors, Telesystem and iNovia Capital. This financing round follows extremely positive tests results from leading Asian manufacturers who will incorporate Metafoam’s copper foam wick structures in [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, January 12, 2011 – Metafoam Technologies announces the completion of a multi-million dollar investment from its current investors, Telesystem and iNovia Capital. This financing round follows extremely positive tests results from leading Asian manufacturers who will incorporate Metafoam’s copper foam wick structures in their heat pipes to reduce the heat in portable computers. The funds will be used for the set up and installation of Metafoam’s manufacturing facilities in Asia.<BR/><BR/>&#8220;We are pleased with the finalization of this financing round which will enable us to move forward with our strategy, by establishing manufacturing and operation capabilities in Asia to supply the electronic thermal industry with our products,” said Vincent Guyaux, President and CEO of Metafoam.<BR/><BR/>About Telesystem<BR/>Telesystem is a Canadian private corporation that owns, builds and manages innovative businesses around the world. Telesystem leverages technology and entrepreneurship to grow sustainable businesses in diverse and promising fields such as health &amp; Environment, media &amp; Entertainment, Internet &amp; Software and industrial innovations. For more information please visit <A HREF="http://www.telesystem.ca" TARGET="_self">www.telesystem.ca</A>.<BR/><BR/>About iNovia Capital<BR/>iNovia provides venture capital to entrepreneurs who transform innovations into successful companies. The team is comprised of sector experts focused on Mobile, Consumer Internet, Internet Communications, Software and Digital Media. iNovia has $165M under management across two seed and early stage IT and Life Sciences funds. For more information, visit <A HREF="http://www.inoviacapital.com" TARGET="_self">www.inoviacapital.com</A> or follow iNovia on Twitter at <A HREF="http://twitter.com/iNovia" TARGET="_self">http://twitter.com/iNovia</A>.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell metal foams. Through its patented technologies, Metafoam redefines the open-cell metal foams industry by offering the highest specific surface area. Metafoam focuses on open-cell copper foam wick structures for the electronic thermal management market, in particular for applications such as heat pipes and vapor chambers.<BR/><BR/>- 30 –<BR/><BR/>Phone: +1 (450) 444 5678<BR/><A HREF="mailto:info@metafoam.com?subject=Request from metafoam.com" TARGET="">info@metafoam.com</A> <br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam Selected as Best Company at the 2010 Venture Capital Forum</title>
			<link>http://metafoam.com/blog/2010/02/04/metafoam-selected-as-best-company-at-the-2010-venture-capital-forum</link>
			<comments>http://metafoam.com/blog/2010/02/04/metafoam-selected-as-best-company-at-the-2010-venture-capital-forum</comments>
			<pubDate>Thu, 04 Feb 2010 08:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2010/02/04/metafoam-selected-as-best-company-at-the-2010-venture-capital-forum</guid>
			<description><![CDATA[Montreal, Canada, February 4, 2010 – Metafoam Technologies is proud to announce that it was selected as Best Company at the 6th Venture Capital Forum held in Montreal during the three first days of February. The Venture Capital Forum is a yearly event that gathers innovative companies looking for financing in the Life Science, Information and [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, February 4, 2010 – Metafoam Technologies is proud to announce that it was selected as Best Company at the 6th Venture Capital Forum held in Montreal during the three first days of February. The Venture Capital Forum is a yearly event that gathers innovative companies looking for financing in the Life Science, Information and Communication Technology, and Clean Technology sectors. Participating companies have the possibility to present their business and to meet with venture capital firms’ representatives while competing with each other in a formal contest that crowns the best and most promising ventures.<BR/><BR/>&#8220;We are honored and very pleased to receive this award”, said Vincent Guyaux, President and CEO of Metafoam. &#8220;This recognition from the Venture Capital Forum and its experienced jury members is a testimony of the strength and potential of Metafoam’s business”, Mr. Guyaux added.<BR/><BR/>About the Venture Capital Forum<BR/>The Forum is organized by the French Chamber of Commerce in Canada. Founded in 1886 and with 1 500 members in Canada, the Chamber's role is to develop trade relations between France and Canada.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell metal foams. Through its patented technologies, Metafoam redefines the open-cell metal foams industry by offering the highest specific surface area. Metafoam focuses on open-cell copper foam wick structures for the electronic thermal management market, in particular for applications such as heat pipes and vapor chambers.<BR/><BR/>- 30 -<BR/><BR/>Phone: +1 (450) 444 5678<BR/>info@metafoam.com<br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam Closes Financing Round</title>
			<link>http://metafoam.com/blog/2009/10/23/metafoam-closes-financing-round</link>
			<comments>http://metafoam.com/blog/2009/10/23/metafoam-closes-financing-round</comments>
			<pubDate>Fri, 23 Oct 2009 18:10:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2009/10/23/metafoam-closes-financing-round</guid>
			<description><![CDATA[Montreal, Canada, October 23, 2009 – Metafoam Technologies announces the completion of a multi-million dollar investment led by ID Capital and MSBi Capital, two venture capital institutions that have supported Metafoam in previous rounds. The investment will be used to continue market development and work with PC manufacturers to integrate [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, October 23, 2009 – Metafoam Technologies announces the completion of a multi-million dollar investment led by ID Capital and MSBi Capital, two venture capital institutions that have supported Metafoam in previous rounds. The investment will be used to continue market development and work with PC manufacturers to integrate Metafoam's products into thermal management solutions.<BR/><BR/>About FIER ID and ID Capital<BR/>FIER ID, s.e.c. is a fund managed by ID Capital, a venture capital firm which invests in innovative start-up businesses located mainly in the greater Montreal area. The businesses targeted by ID Capital must have developed innovative technologies or products that can be protected through patents and must show vast market potential. Additional information about ID Capital is available at www.idcapital.ca.<BR/><BR/>About MSBi Capital<BR/>MSBi Capital is a seed and early stage venture capital fund dedicated to commercializing innovations in information technology, life sciences, and the physical sciences. MSBi Capital has a particular focus on establishing and building companies based on technology advancements and inventions originating from the universities of McGill, Sherbrooke and Bishop's, as well as their affiliated hospitals and research institutes. More information about MSBi is available at www.msbi.ca.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell metal foams. Through its patented technologies, Metafoam redefines the open-cell metal foams industry by offering the highest specific surface area. Metafoam focuses on open-cell copper foam wick structures for the electronic thermal management market, in particular for applications such as heat pipes and vapor chambers.<BR/><BR/>- 30 -<BR/><BR/>Phone: +1 (450) 444 5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam Announces Superior Test Results for its Copper Foam Wick Structure used in Heat Pipes</title>
			<link>http://metafoam.com/blog/2009/10/15/metafoam-announces-superior-test-results-for-its-copper-foam-wick-structure-used-in-heat-pipes</link>
			<comments>http://metafoam.com/blog/2009/10/15/metafoam-announces-superior-test-results-for-its-copper-foam-wick-structure-used-in-heat-pipes</comments>
			<pubDate>Thu, 15 Oct 2009 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2009/10/15/metafoam-announces-superior-test-results-for-its-copper-foam-wick-structure-used-in-heat-pipes</guid>
			<description><![CDATA[Montreal, Canada, October 15, 2009 – Metafoam Technologies Inc. announces that, following extensive tests with partners as well as with a third party thermal management test specialist, heat pipes using copper foam wick structures developed by Metafoam achieve superior dry-out results compared to regular sintered copper powder wick-based heat [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, October 15, 2009 – Metafoam Technologies Inc. announces that, following extensive tests with partners as well as with a third party thermal management test specialist, heat pipes using copper foam wick structures developed by Metafoam achieve superior dry-out results compared to regular sintered copper powder wick-based heat pipes. For single 90 degrees bend heat pipes of 250 millimeters in length, with an outside diameter of 6 millimeters, flattened to 3 millimeters, average dry-out was 72 watts while some heat pipes reached a dry-out of over 120 watts. This average dry-out result represents an improvement of at least 65% compared to standard sintered copper powder heat pipes.<BR/><BR/>&#8220;We are very pleased by these excellent results”, said Dominic Pilon, Founder and CTO of Metafoam. &#8220;After several years of research and development, we have reached our vision of using our open-cell copper foams as a replacement to sintered copper powder wicks by providing much improved thermal management capabilities. Metafoam’s wicks enable the development and production of longer, thinner heat pipes to answer the future requirements of the electronic cooling industry”, added Mr. Pilon.<BR/><BR/>Metafoam’s metal foams are manufactured through a unique proprietary process licensed from the National Research Council of Canada. This process highly enhances the porosity and pumping speed of copper foam wicks compared to other wick structures. These unique advantages are particularly fitted for wick applications found in the electronic cooling industry by improving dry-out, Q-max, and thermal resistances. Moreover, heat pipes and thermal modules manufacturers do not have to change their current manufacturing processes since Metafoam’s copper foam can be shaped and adapted to existing constraints and designs.<BR/><BR/>&#8220;The tests results obtained in the last 12 months clearly show that it is possible to replace one 8 millimeters or two 6 millimeters sintered powder wick heat pipes by one 6 millimeters copper foam wick heat pipe using Metafoam’s technology”, said Vincent Guyaux, President and CEO of Metafoam. &#8220;This means lower production costs and enhanced space usage for thermal modules and electronics systems manufacturers and designers”, added Mr. Guyaux.<BR/><BR/>Metafoam Technologies will be present at the AMD Technical Forum and Exhibition on October 20th 2009 in Taipei, Taiwan.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies (www.metafoam.com) is specialized in the development, production and commercialization of open-cell metal foams. Through its patented technologies, Metafoam redefines the open-cell metal foams industry by offering the highest specific surface area. Metafoam focuses on open-cell copper foam wick structures for the electronic thermal management market, in particular for applications such as heat pipes and vapor chambers.<BR/><BR/>- 30 -<BR/><BR/>Phone: +1 (450) 444 5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam's CTO &amp; Founder Speaks at the AMD Technical Forum &amp; Exposition 2008</title>
			<link>http://metafoam.com/blog/2008/10/22/metafoams-cto-founder-speaks-at-the-amd-technical-forum-exposition-2008</link>
			<comments>http://metafoam.com/blog/2008/10/22/metafoams-cto-founder-speaks-at-the-amd-technical-forum-exposition-2008</comments>
			<pubDate>Wed, 22 Oct 2008 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2008/10/22/metafoams-cto-founder-speaks-at-the-amd-technical-forum-exposition-2008</guid>
			<description><![CDATA[Montreal, Canada, October 22, 2008 – Metafoam’s Founder, Vice President R&amp;D and CTO, Dominic Pilon, has presented the paper &#8220;Open-Cell Metal Foams for Electronics Cooling” at the AMD Technical Forum &amp; Exposition 2008 in Taipei, Taiwan. During his presentation Mr. Pilon presented initial test results of 57% increase in [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, October 22, 2008 – Metafoam’s Founder, Vice President R&amp;D and CTO, Dominic Pilon, has presented the paper &#8220;Open-Cell Metal Foams for Electronics Cooling” at the AMD Technical Forum &amp; Exposition 2008 in Taipei, Taiwan. During his presentation Mr. Pilon presented initial test results of 57% increase in performance of Metafoam's metal foams used as wick structures for heat pipes compared to the current industry-wide practice using sintered copper powder.<BR/><BR/>The AMD Technical Forum &amp; Exposition 2008 has focused on advanced technology for multimedia and graphics platforms and hardware applications. Topics addressed during this forum were numerous and included amongst others:<BR/><UL><LI>Power Technology and Thermal Modeling for Desktop and Notebooks</LI><LI>EMI Testing</LI><LI>PCB Manufacturing</LI><LI>Memory Technologies </LI></UL>For more information on the AMD Technical Forum and Exposition 2008, please visit:<BR/><A HREF="http://www.amd.com/us-en/0%2c%2c3715_15467_15469%2c00.html" TARGET="_self">http://www.amd.com/us-en/0%2c%2c3715_15467_15469%2c00.html</A><BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30 -<BR/><BR/>Phone: +1 (450) 444 5678<BR/><A HREF="mailto:info@metafoam.com?subject=inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam's CTO &amp; Founder, Speaks at Cellmet 2008</title>
			<link>http://metafoam.com/blog/2008/10/11/metafoams-cto-founder-speaks-at-cellmet-2008</link>
			<comments>http://metafoam.com/blog/2008/10/11/metafoams-cto-founder-speaks-at-cellmet-2008</comments>
			<pubDate>Sat, 11 Oct 2008 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2008/10/11/metafoams-cto-founder-speaks-at-cellmet-2008</guid>
			<description><![CDATA[Montreal, Canada, October 11, 2008 – Metafoam’s Founder, Vice President R&amp;D and CTO, Dominic Pilon, has presented the paper &#8220;Lace-Type Open-Cell Metal Foams for Enhanced Phase-Change Heat Transfer” at Cellmet 2008. This symposium, about cellular metals for functional applications, was held on October 8th to 10th, 2008 in [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, October 11, 2008 – Metafoam’s Founder, Vice President R&amp;D and CTO, Dominic Pilon, has presented the paper &#8220;Lace-Type Open-Cell Metal Foams for Enhanced Phase-Change Heat Transfer” at Cellmet 2008. This symposium, about cellular metals for functional applications, was held on October 8th to 10th, 2008 in Dresden, Germany. Organized by the Fraunhofer Institute for Manufacturing and Advanced Materials (IFAM), Cellmet 2008 has gathered for three days, the scientific community working on cellular metals and their applications. More information about Cellmet can be found at:  http://www.cellmet.de<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30 -<BR/><BR/>Phone: +1 (450) 444 5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Vincent Guyaux appointed as the new President and CEO of Metafoam</title>
			<link>http://metafoam.com/blog/2008/07/15/vincent-guyaux-appointed-as-the-new-president-and-ceo-of-metafoam</link>
			<comments>http://metafoam.com/blog/2008/07/15/vincent-guyaux-appointed-as-the-new-president-and-ceo-of-metafoam</comments>
			<pubDate>Tue, 15 Jul 2008 09:18:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2008/07/15/vincent-guyaux-appointed-as-the-new-president-and-ceo-of-metafoam</guid>
			<description><![CDATA[Montreal, Canada, July 15th, 2008 – Metafoam Technologies Inc. announces that its Board of Directors has appointed Vincent Guyaux as the new President and CEO of Metafoam.<BR/><BR/>Vincent Guyaux has extensive management and business development expertise in North America, Asia and Europe in high-tech industries. Since 2008, he is President [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, July 15th, 2008 – Metafoam Technologies Inc. announces that its Board of Directors has appointed Vincent Guyaux as the new President and CEO of Metafoam.<BR/><BR/>Vincent Guyaux has extensive management and business development expertise in North America, Asia and Europe in high-tech industries. Since 2008, he is President &amp; CEO of Metafoam, a metal foam manufacturer. Prior to that, Vincent was President &amp; CEO of Imaginum, a fabless chip manufacturer, Co-founder and President of Embrase Business Consulting, General Manager of Mindready's Embedded Systems Division, Vice-President of Sales and Marketing at Locus Dialog (acquired by InfoSpace) and Sales Manager at Apple Canada. Since 2006, he also guest-lectures on creating business plans for the MBA program at McGill University. Vincent holds a diploma in Applied Computer Science from the University of Quebec in Montreal.<BR/><BR/>&#8220;We are very pleased to appoint Vincent as the new President and CEO of Metafoam” said Mr. Brûlé, Chairman of the Board of Metafoam Technologies. &#8220;His experience will be paramount in achieving our objectives of developing the Asian market, finding partners and customers and growing the company.” Mr. Brûlé added.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30 -<BR/><BR/>Phone: +1 (450) 444 5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Latest Generation of Metafoam's Boiling Surfaces Can Manage Heat Loads Close to 500 Watts</title>
			<link>http://metafoam.com/blog/2008/01/31/latest-generation-of-metafoams-boiling-surfaces-can-manage-heat-loads-close-to-500-watts</link>
			<comments>http://metafoam.com/blog/2008/01/31/latest-generation-of-metafoams-boiling-surfaces-can-manage-heat-loads-close-to-500-watts</comments>
			<pubDate>Thu, 31 Jan 2008 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2008/01/31/latest-generation-of-metafoams-boiling-surfaces-can-manage-heat-loads-close-to-500-watts</guid>
			<description><![CDATA[Montreal, Canada, January 31, 2008 – Metafoam Technologies Inc. is proud to announce that its latest generation of boiling surfaces is reaching new heights. Latest test results reveal that Metafoam's boiling surfaces, based on its metal foam technological platform, can handle heat fluxes up to 76 watts per square centimeter, meaning close to [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, January 31, 2008 – Metafoam Technologies Inc. is proud to announce that its latest generation of boiling surfaces is reaching new heights. Latest test results reveal that Metafoam's boiling surfaces, based on its metal foam technological platform, can handle heat fluxes up to 76 watts per square centimeter, meaning close to 500 watts for a standard processor die.<BR/><BR/>"This new generation of pool boiling surfaces allows Metafoam to consolidate its position in the electronic thermal management market", according to Dominic Pilon, Metafoam's Founder and Chief Technology Officer.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30 -<BR/><BR/>Phone: +1 (450) 444 5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam Sets Up its Prototype Production Plant in Montreal, Canada</title>
			<link>http://metafoam.com/blog/2007/05/15/metafoam-sets-up-its-prototype-production-plant-in-montreal-canada</link>
			<comments>http://metafoam.com/blog/2007/05/15/metafoam-sets-up-its-prototype-production-plant-in-montreal-canada</comments>
			<pubDate>Tue, 15 May 2007 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2007/05/15/metafoam-sets-up-its-prototype-production-plant-in-montreal-canada</guid>
			<description><![CDATA[Montreal, Canada, May 15, 2007 – Metafoam Technologies Inc. announces that it has acquired its own equipment for the prototyping and production of metal foams in the Montreal Metropolitan Area. This will allow Metafoam to meet the demand for its metal foams from the electronics cooling, especially for heat pipes and vapor [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, May 15, 2007 – Metafoam Technologies Inc. announces that it has acquired its own equipment for the prototyping and production of metal foams in the Montreal Metropolitan Area. This will allow Metafoam to meet the demand for its metal foams from the electronics cooling, especially for heat pipes and vapor chambers.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30-<BR/><BR/>Phone: +1 (450) 444-5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam Closes Financing Round</title>
			<link>http://metafoam.com/blog/2007/02/01/metafoam-closes-financing-round</link>
			<comments>http://metafoam.com/blog/2007/02/01/metafoam-closes-financing-round</comments>
			<pubDate>Thu, 01 Feb 2007 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2007/02/01/metafoam-closes-financing-round</guid>
			<description><![CDATA[Montreal, Canada, February 1, 2007 – Metafoam Technologies Inc., a leading edge manufacturer of innovative open-cell metal foams, is proud to announce that it has received a multi-million dollar investment from BDC Venture Capital, FIER ID, MSBi Capital, and M&amp;M Investments. This injection of capital will allow the company to pursue its [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, February 1, 2007 – Metafoam Technologies Inc., a leading edge manufacturer of innovative open-cell metal foams, is proud to announce that it has received a multi-million dollar investment from BDC Venture Capital, FIER ID, MSBi Capital, and M&amp;M Investments. This injection of capital will allow the company to pursue its development and commercialization efforts<BR/><BR/>&#8220;The financial backing by such reputable investors is the recognition of the competitive advantages of our platform and of its wide range of applications”, said Dominic Pilon, Metafoam’s Founder, Vice President R&amp;D and CTO. &#8220;Our metal foams possess the highest specific area in the industry, high manufacturing process repeatability, and significantly lower production costs. This allows us to go after markets that, until recently, could not even contemplate using metallic foams."<BR/><BR/>&#8220;For us, this investment is first and foremost the result of the determination of a young entrepreneur, Dominic Pilon, with whom M&amp;M Investments has partnered in the past two years. Metafoam inherits what it worked for: financial supporters that will make a difference”, declared Michel Brûlé, Chairman of the Board of Metafoam and President of M&amp;M Investment.<BR/><BR/>&#8220;The success of this first round of financing and the fact that a number of investors became involved attest to Metafoam’s potential,” said Réjean Asselin, Director, Technology Seed Investments at BDC.<BR/><BR/>&#8220;ID Capital believes that metallic foams are poised to provide break-through performance enhancements to a variety of industrial processes and high-end products, in particular the areas of thermal management and electrochemistry show great promise”, added Daniel Cyr, Managing Partner ID Capital.<BR/><BR/>&#8220;MSBi is proud to lend its support to a company looking to establish strong partnerships with global players in the $5B electronics cooling market and has a strong upside in clean technologies and energy applications”, said Chris Arsenault, Partner at MSBi Capital. &#8220;We have high expectations of Metafoam’s capabilities to deliver innovative metal foam products into rapid-growth markets such as the energy market”.<BR/><BR/>About BDC Venture Capital<BR/>BDC Venture Capital is a major venture capital investor in Canada, active at every stage of the company’s development cycle, from seed through expansion, with a focus on technology-based businesses that have high growth potential and are positioned to become dominant players in their markets. BDC Venture Capital has been involved in venture capital since 1975, and has to date invested in more than 400 different companies. It currently manages approximately $550 million in venture capital assets invested in the areas of Life Sciences, Telecommunications, Information Technology, Advanced Technologies and Fund Investments. For more information, see www.bdc.ca.<BR/><BR/>About FIER ID and ID Capital<BR/>FIER ID, s.e.c. is a fund managed by ID Capital, a venture capital firm which invests in innovative start-up businesses located mainly in the greater Montreal area. The businesses targeted by ID Capital must have developed innovative technologies or products that can be protected through patents and must show vast market potential. Additional information about ID Capital is available at www.idcapital.ca.<BR/><BR/>About MSBi Capital<BR/>MSBi Capital is a seed and early stage venture capital fund dedicated to commercializing innovations in information technology, life sciences, and the physical sciences. MSBi Capital has a particular focus on establishing and building companies based on technology advancements and inventions originating from the universities of McGill, Sherbrooke and Bishop's, as well as their affiliated hospitals and research institutes. More information about MSBi is available at www.msbi.ca.<BR/><BR/>About M&amp;M Investments<BR/>M&amp;M Investments is a private investment fund created to assist emerging companies to maximise capitalization of their competitive advantages.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30 –<BR/><BR/>Phone: +1 (450) 444-5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam Obtains a Second Financing Support from Canada Economic Development</title>
			<link>http://metafoam.com/blog/2006/09/20/metafoam-obtains-a-second-financing-support-from-canada-economic-development</link>
			<comments>http://metafoam.com/blog/2006/09/20/metafoam-obtains-a-second-financing-support-from-canada-economic-development</comments>
			<pubDate>Wed, 20 Sep 2006 06:20:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2006/09/20/metafoam-obtains-a-second-financing-support-from-canada-economic-development</guid>
			<description><![CDATA[Montreal, Canada, September 20, 2006 – Metafoam Technologies Inc. announces the approval of a financial assistance from IDEA-SME program of Canada Economic Development (CED). The funds provided will be used to support Metafoam’s commercialization of its advanced materials. Specifically, the funds will be used to set-up and consolidate [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, September 20, 2006 – Metafoam Technologies Inc. announces the approval of a financial assistance from IDEA-SME program of Canada Economic Development (CED). The funds provided will be used to support Metafoam’s commercialization of its advanced materials. Specifically, the funds will be used to set-up and consolidate strategic partnerships with leaders in the electronic thermal management industry.<BR/><BR/>Metafoam would like to thank CED for this second financial assistance. IDEA-SME is a financial assistance program that fosters the growth of small and medium-sized enterprises in the province of Quebec. It also helps SMEs to become more competitive on world markets by supporting SMEs in their innovation approach and by facilitating the marketing of technologies resulting from research and development.<BR/><BR/>About CED<BR/>The Economic Development Agency of Canada for the Regions of Quebec provides assistance to enterprises, communities and the organizations that support them through its network of 14 business offices located throughout the province.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30 -<BR/><BR/>Phone: +1 (450) 444 5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam Signs a Licensing Agreement with NRC</title>
			<link>http://metafoam.com/blog/2006/07/20/metafoam-signs-a-licensing-agreement-with-nrc</link>
			<comments>http://metafoam.com/blog/2006/07/20/metafoam-signs-a-licensing-agreement-with-nrc</comments>
			<pubDate>Thu, 20 Jul 2006 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2006/07/20/metafoam-signs-a-licensing-agreement-with-nrc</guid>
			<description><![CDATA[Montreal, Canada, July 20, 2006 – Metafoam Technologies Inc. is proud to announce that it has signed a licensing agreement with the Industrial Materials Institute (IMI) of Canada’s National Research Council (NRC) for the development, production, and commercialization of metal foams through their patented manufacturing process. This [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, July 20, 2006 – Metafoam Technologies Inc. is proud to announce that it has signed a licensing agreement with the Industrial Materials Institute (IMI) of Canada’s National Research Council (NRC) for the development, production, and commercialization of metal foams through their patented manufacturing process. This licence agreement adds to Metafoam’s technology and patents portfolio and allows the company to produce open-cell metal foams with the industry's largest surface area and lowest production costs.<BR/><BR/>&#8220;Signing this agreement was an important step in our company’s development”, said Dominic Pilon, CEO and founder of Metafoam. &#8220;We are grateful for the confidence the NRC has shown us, and we are now equipped with all the tools we need to conquer our target markets. Our company is now poised for an important breakthrough.”<BR/><BR/>&#8220;For us, Metafoam is the right partner to convert this exciting NRC technology into a commercial success”, stated Blaise Champagne, Director General of NRC-IMI. &#8220;Their combination of technical knowledge, business acumen and dynamic spirit were what we needed from a partner to bring this material to market. We look forward to continued work with Metafoam to help them adapt this product for their growing list of partners.”<BR/><BR/>Recognized globally for research and innovation, Canada's National Research Council is a leader in the development of an innovative, knowledge-based economy for Canada through science and technology. As part of the NRC, the Industrial Materials Institute is a R&amp;D center focussed on materials, their formulation and forming, as well as the control of their processes. It helps Canadian companies meet the risks of the new economy by providing them competitive advantages and the required leverage to grasp opportunities.<BR/><BR/>About NRC<BR/>NRC is the Government of Canada's leading resource for research, development and technology-based innovation. NRC comprises some 20 institutes and national programs, spanning a wide variety of disciplines and offering a broad array of services.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30-<BR/><BR/>Phone: +1 (450) 444-5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam Obtains Seed Financing from BDC Venture Capital</title>
			<link>http://metafoam.com/blog/2005/09/12/metafoam-obtains-seed-financing-from-bdc-venture-capital</link>
			<comments>http://metafoam.com/blog/2005/09/12/metafoam-obtains-seed-financing-from-bdc-venture-capital</comments>
			<pubDate>Mon, 12 Sep 2005 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2005/09/12/metafoam-obtains-seed-financing-from-bdc-venture-capital</guid>
			<description><![CDATA[Montreal, Canada, September 12, 2005 – Metafoam Technologies Inc. today announces the closing of a seed financing agreement with the Business Development Bank of Canada (BDC) Seed Technology Group. This disbursement from BDC constitutes the first investment in Metafoam.<BR/><BR/>Involved in venture capital since 1975, BDC Venture Capital is a [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, September 12, 2005 – Metafoam Technologies Inc. today announces the closing of a seed financing agreement with the Business Development Bank of Canada (BDC) Seed Technology Group. This disbursement from BDC constitutes the first investment in Metafoam.<BR/><BR/>Involved in venture capital since 1975, BDC Venture Capital is a major venture capital investor in Canada. To date, BDC Venture Capital has invested in more than 400 companies. BDC is active at every stage of the company's development cycle, from seed through expansion, with a focus on technology-based businesses that have high growth potential and that are positioned to become dominant players in their markets.<BR/><BR/>About BDC<BR/>BDC Venture Capital is a major venture capital investor in Canada, active at every stage of the company's development cycle, from seed through expansion, with a focus on technology-based businesses that have high growth potential and that are positioned to become dominant players in their markets.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30-<BR/> <BR/>Phone: +1 (450) 444-5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam Wins the 2005 Quebec Entrepreneurship Contest</title>
			<link>http://metafoam.com/blog/2005/06/22/metafoam-wins-the-2005-quebec-entrepreneurship-contest</link>
			<comments>http://metafoam.com/blog/2005/06/22/metafoam-wins-the-2005-quebec-entrepreneurship-contest</comments>
			<pubDate>Wed, 22 Jun 2005 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2005/06/22/metafoam-wins-the-2005-quebec-entrepreneurship-contest</guid>
			<description><![CDATA[Montreal,Canada, June 22, 2005 – Metafoam Technologies Inc. received First Prize in the Technological and Technical Innovations Category during the June 21st edition of the Quebec Entrepreneurship Contest held in Quebec City. The company has been declared the best newcomer in the high-tech field of the Province of Quebec. Metafoam has also [...]]]></description>
			<content:encoded><![CDATA[Montreal,Canada, June 22, 2005 – Metafoam Technologies Inc. received First Prize in the Technological and Technical Innovations Category during the June 21st edition of the Quebec Entrepreneurship Contest held in Quebec City. The company has been declared the best newcomer in the high-tech field of the Province of Quebec. Metafoam has also been awarded a business trip to France with the Office Franco-Québécois pour la Jeunesse.<BR/><BR/>Since its introduction seven years ago, the Quebec Entrepreneurship Contest has come to be recognized as the biggest contest of its kind in the province of Quebec. It is designed to promote the development of entrepreneurship in Quebec by rewarding business creation. With this goal in mind, the contest seeks the involvement of representatives from the world of education, the business community and community organizations.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30-<BR/><BR/>Phone: +1 (450) 444-5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam Obtains Financing Support from Canada Economic Development</title>
			<link>http://metafoam.com/blog/2004/12/03/metafoam-obtains-financing-support-from-canada-economic-development</link>
			<comments>http://metafoam.com/blog/2004/12/03/metafoam-obtains-financing-support-from-canada-economic-development</comments>
			<pubDate>Fri, 03 Dec 2004 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2004/12/03/metafoam-obtains-financing-support-from-canada-economic-development</guid>
			<description><![CDATA[Montreal, Canada, December 3, 2004 – Metafoam Technologies Inc. has obtained financing from Canada Economic Development (CED) via the Innovation, Development, Entrepreneurship and Access Program for SMEs (IDEA-SME). These funds will be used to start commercialization efforts such as hiring marketing personnel, designing promotional tools and [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, December 3, 2004 – Metafoam Technologies Inc. has obtained financing from Canada Economic Development (CED) via the Innovation, Development, Entrepreneurship and Access Program for SMEs (IDEA-SME). These funds will be used to start commercialization efforts such as hiring marketing personnel, designing promotional tools and participating in various trade shows and conferences in Metafoam’s targeted markets, which will lead to the market introduction of products.<BR/><BR/>IDEA-SME is a financial assistance program that fosters the growth of small and medium-sized enterprises in Canada. It also helps SMEs to become more competitive in world markets by supporting SMEs in their innovation activities and facilitating the marketing of technologies resulting from research and development.<BR/><BR/>About CED<BR/>The Economic Development Agency of Canada for the Regions of Quebec provides assistance to enterprises, communities and the organizations that support them through its network of 14 business offices located throughout the province.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30 -<BR/><BR/>Phone: +1 (450) 444-5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam is Invited at the Emerging Technology Venture Conference</title>
			<link>http://metafoam.com/blog/2004/09/02/metafoam-is-invited-at-the-emerging-technology-venture-conference</link>
			<comments>http://metafoam.com/blog/2004/09/02/metafoam-is-invited-at-the-emerging-technology-venture-conference</comments>
			<pubDate>Thu, 02 Sep 2004 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2004/09/02/metafoam-is-invited-at-the-emerging-technology-venture-conference</guid>
			<description><![CDATA[Montreal, Canada, September 2, 2004 – Metafoam Technologies Inc. was selected as one of Canada’s twelve Best Emerging Technology Companies as it was invited to the Emerging Technology Venture Conference (ETVC) 2004 that will be held in Montreal, Quebec on September 14th and 15th, 2004.<BR/><BR/>ETVC 2004 is Canada’s first conference [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, September 2, 2004 – Metafoam Technologies Inc. was selected as one of Canada’s twelve Best Emerging Technology Companies as it was invited to the Emerging Technology Venture Conference (ETVC) 2004 that will be held in Montreal, Quebec on September 14th and 15th, 2004.<BR/><BR/>ETVC 2004 is Canada’s first conference to bring together high-tech companies with international investors. The event showcases the best technologies in Information Technology, Nanotechnology and Robotics to angel investors and venture capital firms from Canada, the United States, Europe and Asia. The companies were selected from over 40 applications by the ETVC selection committee. The 250 participants expected to attend this event will include some of the most prominent venture capital firms and financial institutions, academics, corporate labs and institutional investors.<BR/><BR/>About Metafoam Technologies<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30-<BR/><BR/>Phone: +1 (450) 444-5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
		<item>
			<title>Metafoam Technologies is Created</title>
			<link>http://metafoam.com/blog/2004/02/01/metafoam-technologies-is-created</link>
			<comments>http://metafoam.com/blog/2004/02/01/metafoam-technologies-is-created</comments>
			<pubDate>Sun, 01 Feb 2004 06:00:00 +0000</pubDate>
			<dc:creator></dc:creator>
			<guid isPermaLink="false">http://metafoam.com/blog/2004/02/01/metafoam-technologies-is-created</guid>
			<description><![CDATA[Montreal, Canada, February 1, 2004 – Metafoam Technologies Inc., a new Canadian enterprise working on metallic foams and their commercial applications, has been officially created. Metafoam's basic technology comes from a discovery made at the Industrial Materials Institute (IMI) of the National Research Council of Canada (NRC). In 2001, [...]]]></description>
			<content:encoded><![CDATA[Montreal, Canada, February 1, 2004 – Metafoam Technologies Inc., a new Canadian enterprise working on metallic foams and their commercial applications, has been officially created. Metafoam's basic technology comes from a discovery made at the Industrial Materials Institute (IMI) of the National Research Council of Canada (NRC). In 2001, IMI-NRC developed a new metal foam production process which alleviates the constraints of conventional processes. In sum, the IMI-NRC process leads to the highest specific surface area in the metal foam industry due to the unique microstructure of this material. Thanks to a spin-off program aiming to create commercially viable enterprises from public research and development funds from the NRC, Metafoam was created with the objectives to continue the development and to start the commercialization of this new technology.<BR/><BR/>Metafoam’s founder and CEO, Dominic Pilon, has been working with the IMI-NRC for several years. &#8220;We are very excited to create this new venture” said Mr. Pilon. &#8220;The research efforts from the IMI-NRC, has capitalized on a very promising innovation which has many potential applications. It is Metafoam’s intention to continue the research and development activities and to develop the applications best suited for the markets.” he added.<BR/><BR/>About Metafoam<BR/>Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.<BR/><BR/>- 30 -<BR/><BR/>Phone: +1 (450) 444 5678<BR/><A HREF="mailto:info@metafoam.com?subject=Inquiry" TARGET="">info@metafoam.com</A><br><br>]]></content:encoded>
		</item>
	</channel>
</rss>

