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Metafoam innovative material is revolutionizing pool boiling technologies by significantly increasing performance of boiling surfaces. As such, Metafoam is facilitating the introduction of new generations of thermosyphons.
Actually, Metafoam's solution reaches high critical heat fluxes while maintaining a low surface superheat. Critical heat flux and surface superheat are respectively up to 2.6 and 7 times better than coatings of sintered copper powders and plain copper surface.
Metafoam's boiling surfaces can manage heat loads of 80 W/cm², i.e. about 500 watts for a standard CPU. 
Related Web Pages
Brochure - Metafoam's boiling plates (PDF)
In the News - Latest Generation of Boiling Plates Can Manage Heat Loads Close to 500 Watts
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