Introduction

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The thermal management of electronic components and systems has become a major challenge in recent years. By increasing the density of transistors, manufacturers have enabled constant performance improvements. However, those powerful microprocessors generate higher heat fluxes that need to be quickly dissipated or they will impact the lifespan, reliability and performance of the products in which they are placed.

Metafoam addresses this challenge by providing a more efficient wick structure for heat pipe and vapor chamber products than legacy sintered powder wicks.

Such enhanced performance characteristics lead to the following benefits for cooling solution manufacturers:

• Thin and powerful wick (≥ 300 µm) giving possibility for 2mm thick flat heat pipes
• Higher heat load capacity / dry out point (>65% increase in dry-out vs. legacy sintered powder)
• Uniform foam thickness (increased yield)
• Increased thermal management efficiency and reduced hot spots
• Large wick lateral dimensions
• L and U shaped wicks for special vapor chamber designs
• Streamlined manufacturing process reducing costs
• Highest specific surface area in the industry
• Excellent process repeatability and control

Metafoam also provides another improvement in the production of wicking structures in which the bonds between the foam and the copper rods and/or plates – whatever their shapes for both heat pipes and vapor chambers - are stronger than the bonds obtained with sintered powder wicking structure manufacturing techniques currently used industry-wide.